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Steel Structure & Building Envelope
南通赛米半导体科技工厂
南通赛米半导体科技工厂项目
Business Type
钢结构及建筑围护工程
Location
南通
Building Area
18000
Start Date
2025
Services
- 钢结构及建筑围护工程
Client Info
Client
保密客户
Project Highlights
This project showcases Wing+'s professional capabilities and innovative spirit in the field of building engineering.